Salim Badakhshan
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Lenovo ThinkBook Plus Gen 2 Huaqin NB3093 Schematic
Technical Specifications
Technical Summary
The HuaQin Thinkbook plus gen2 (Project Code NB3093, Board Number NB3629, Revision V4.0) motherboard is built around an Intel TGL Lake UP4-Processor with LPDDR4x memory architecture. The system utilizes an IT5571VG EC/KBC and a Realtek ALC3306-CG audio codec. BIOS storage is handled by a 16MB SPI ROM 1, while EC firmware resides on SPI ROM 2. Power management includes a TPS65994 charging IC and a TPS65185 PMIC. Memory is configured as dual-channel LPDDR4x down, supporting various densities from 8GB to 16GB using Micron, Samsung, or Hynix modules. The platform integrates a TUSB1002 USB hub and HDMI level shifter, a GL9755 card reader, and on-board WLAN/BT via CNVIC. Thermal monitoring is provided by a TCP1 sensor.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The EC/KBC is an IT5571VG.
Q: What is the BIOS flash configuration?
A: The BIOS is stored on a 16MB SPI ROM 1, with EC firmware on a separate SPI ROM 2.
Q: What is the memory architecture?
A: The board uses dual-channel LPDDR4x memory down, supporting 8GB, 16GB configurations from Micron, Samsung, or Hynix.
Q: What charging IC is used?
A: The charging IC is a TPS65994.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | HuaQin |
| Model | Thinkbook plus gen2 |
| Motherboard Manufacturer | Huaqin Telecom Technology Com.,Ltd. |
| Project Code | NB3093 |
| Board Number | NB3629 |
| Revision | V4.0 |
| Date | Saturday, February 20, 2021 |
| CPU Platform | Intel TGL Lake UP4-Processor |
| EC / KBC | IT5571VG |
| Audio Codec | Realtek ALC3306-CG |
| BIOS / SPI Flash | SPI ROM 1 |
| BIOS Flash Capacity | 16MB |
| EC Flash / ROM | SPI ROM 2 |
| Charging IC | TPS65994 |
| Power IC(s) | TPS65185 |
| RAM Type | LPDDR4x |
| RAM Architecture | Memory Down |
| RAM Quantity / Slots | Dual Channel |
| LAN IC | Realtek ALC3306-CG |
| WiFi / WLAN IC | WLAN/BT ON board CNVIC |
| Card Reader IC | GL9755 |
| USB Hub IC | TUSB1002 |
| Thermal Sensor | TCP1 |
| HDMI Level Shifter | TUSB1002 |
Technical Summary
The HuaQin Thinkbook plus gen2 (Project Code NB3093, Board Number NB3629, Revision V4.0) motherboard is built around an Intel TGL Lake UP4-Processor with LPDDR4x memory architecture. The system utilizes an IT5571VG EC/KBC and a Realtek ALC3306-CG audio codec. BIOS storage is handled by a 16MB SPI ROM 1, while EC firmware resides on SPI ROM 2. Power management includes a TPS65994 charging IC and a TPS65185 PMIC. Memory is configured as dual-channel LPDDR4x down, supporting various densities from 8GB to 16GB using Micron, Samsung, or Hynix modules. The platform integrates a TUSB1002 USB hub and HDMI level shifter, a GL9755 card reader, and on-board WLAN/BT via CNVIC. Thermal monitoring is provided by a TCP1 sensor.
Technician FAQ
Q: What EC/KBC is used on this motherboard?
A: The EC/KBC is an IT5571VG.
Q: What is the BIOS flash configuration?
A: The BIOS is stored on a 16MB SPI ROM 1, with EC firmware on a separate SPI ROM 2.
Q: What is the memory architecture?
A: The board uses dual-channel LPDDR4x memory down, supporting 8GB, 16GB configurations from Micron, Samsung, or Hynix.
Q: What charging IC is used?
A: The charging IC is a TPS65994.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
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