Schematic Lenovo IdeaPad Duet 3 10IGL HuaQin NB2329 Schematic

Salim Badakhshan

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Lenovo IdeaPad Duet 3 10IGL HuaQin NB2329 Schematic




Technical Specifications

ParameterValue
BrandHuaqin Telecom Technology Com.,Ltd.
ModelNB2329
Motherboard ManufacturerHuaqin Telecom Technology Com.,Ltd.
Board NumberNB2329
RevisionV4.0
DateFriday, May 15, 2020
CPU PlatformIntel Gemini Lake Refresh Platform
CPU ModelPentium N5030 /Celeron N4020
GPU TypeGLK-R SOC
EC / KBCITE8987
EC/KBC ProgrammableEC-ROM SPI
Audio CodecALC3287
BIOS / SPI FlashSYSTEM SPI FLASH ROM
Charging ICBQ25700A
Charger ArchitectureBuck Boost Charger BQ25700A
Power IC(s)RT5077AGQW, RT6256B, RT9610C
RAM TypeDDR4
RAM ArchitectureSingle CH DDR4 4/8GB CHA, Single CH 2400Mhz
RAM Quantity / Slots4x Samsung 8Gb K4A8G165WC-BCWE, 4x Mircon 8Gb MT40A512M16TB-062E:J, 4x Hynix 8Gb H5AN8G6NCJR-XNC, 4x Hynix 16Gb DDP H5ANAG6NCMR-XNC, 4x Samsung 16Gb K4AAG165WA-BCWE, 4x Mircon 16Gb MT40A1G16KNR-075:E (DDP)
Card Reader ICRTS5232, RTS5830, RTS5876
LAN ICCYW20730
WiFi / WLAN ICWLAN 1216 HP2 AC
Thermal SensorNCT7719W

Technical Summary

The Huaqin NB2329 V4.0 motherboard is built on the Intel Gemini Lake Refresh Platform, supporting Pentium N5030 or Celeron N4020 processors with integrated GLK-R SOC graphics. The board utilizes an ITE8987 EC/KBC with an EC-ROM SPI interface for programming. System firmware is stored on a SYSTEM SPI FLASH ROM. Memory architecture consists of Single Channel DDR4 at 2400MHz, with multiple DRAM configuration options including Samsung, Micron, and Hynix 8Gb and 16Gb components. Power management is handled by a BQ25700A Buck Boost charger, with PMICs RT5077AGQW, RT6256B, and RT9610C generating core voltage rails. Audio is provided by the ALC3287 codec. Connectivity includes WLAN 1216 HP2 AC, CYW20730 BT controller, and multiple card reader ICs (RTS5232, RTS5830, RTS5876). Thermal monitoring is managed by the NCT7719W discrete thermal sensor.

Technician FAQ

Q: What EC/KBC is used on this motherboard?

A: The motherboard uses an ITE8987 EC/KBC with an EC-ROM SPI interface for programming.

Q: What is the charging architecture?

A: The charging architecture is a Buck Boost Charger using the BQ25700A IC.

Q: What memory configurations are supported?

A: The board supports Single Channel DDR4 at 2400MHz, with DRAM options from Samsung, Micron, and Hynix in 8Gb and 16Gb densities.

Q: What power management ICs are used?

A: The PMICs used are RT5077AGQW, RT6256B, and RT9610C.

Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
 

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  • Lenovo IdeaPad Duet 3 10IGL HuaQin NB2329 Schematic.pdf
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