Salim Badakhshan
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Dell Precision 7520 Compal LA-E311P Schematic
Technical Specifications
Technical Summary
This Dell CRANE15 motherboard, manufactured by Compal Electronics, is built on the Kaby Lake H-type platform with board number LA-E311P revision 1.0 (A00). The system memory architecture consists of DDR4 ECC-SO-DIMM X4 across eight banks. The primary BIOS flash is a W25Q128FVSIQ 128Mb SPI ROM, while the EC firmware is stored on a separate W25Q32FVSSIQ 32Mb SPI flash. The embedded controller is a SMSC MEC5085, and the audio subsystem is handled by an ALC3254 codec. Networking is provided by an Intel WGI219LM LAN controller. The motherboard features extensive display connectivity including DP MUX PS8331, DP DEMUX PS8338 and PS8468, DP redriver PS8460, DP to HDMI retimer PS8407A, and DP to VGA converter RTD2166.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Dell |
| Model | CRANE15 |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Board Number | LA-E311P |
| Revision | 1.0 (A00) |
| Date | 1403-06 |
| CPU Platform | Kaby Lake H-type (2 chip) |
| EC / KBC | MEC5085 |
| Audio Codec | ALC3254 |
| BIOS Flash Exact Model | W25Q128FVSIQ |
| BIOS Flash Capacity | 128Mb |
| EC Flash / ROM | W25Q32FVSSIQ |
| EC Flash / ROM Capacity | 32Mb |
| RAM Type | DDR4 |
| RAM Architecture | ECC-SO-DIMM X4 |
| RAM Quantity / Slots | BANK 0, 1, 2, 3, 4, 5, 6, 7 |
| LAN IC | WGI219LM |
| Card Reader IC | RTS5242 |
| TPM IC | NPCT650JB2YX |
| USB Hub IC | PS8713B |
| USB-C Controller | TPS65982 |
| DP Redriver | PS8460 |
| DP to HDMI Retimer | PS8407A |
| DP MUX | PS8331 |
| DP DEMUX | PS8338 |
| DP DEMUX | PS8468 |
| VGA 2:1 SW | TS3V712 |
| SATA/PCIE Repeater | PS8558B |
| USB 3.0 Repeater | PS8713B |
| eDP MUX | PS8331 |
| DP to VGA | RTD2166 |
| Free Fall Sensor | DA280 |
| Smart Card Controller | T8034HN |
| DP MUX | HD3SS214 |
Technical Summary
This Dell CRANE15 motherboard, manufactured by Compal Electronics, is built on the Kaby Lake H-type platform with board number LA-E311P revision 1.0 (A00). The system memory architecture consists of DDR4 ECC-SO-DIMM X4 across eight banks. The primary BIOS flash is a W25Q128FVSIQ 128Mb SPI ROM, while the EC firmware is stored on a separate W25Q32FVSSIQ 32Mb SPI flash. The embedded controller is a SMSC MEC5085, and the audio subsystem is handled by an ALC3254 codec. Networking is provided by an Intel WGI219LM LAN controller. The motherboard features extensive display connectivity including DP MUX PS8331, DP DEMUX PS8338 and PS8468, DP redriver PS8460, DP to HDMI retimer PS8407A, and DP to VGA converter RTD2166.
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
LA-E311P
Board Number
Kaby Lake-H
CPU Platform
MEC5085
EC / KBC
ALC3254
Audio Codec
W25Q128FVSIQ
Firmware Flash Memory
W25Q32FVSSIQ
Firmware Flash Memory
DDR4
RAM Type
WGI219LM
LAN Controller
RTS5242
Card Reader IC
NPCT650JB2YX
TPM / Security IC
PS8713B
USB Controller
TPS65982
USB Controller
PS8331
Signal Conditioning IC
PS8338
Signal Conditioning IC
PS8468
Signal Conditioning IC
PS8558B
Signal Conditioning IC
T8034HN
TPM / Security IC
HD3SS214
Signal Conditioning IC
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
LA-E311P
Board Number
Kaby Lake-H
CPU Platform
MEC5085
EC / KBC
ALC3254
Audio Codec
W25Q128FVSIQ
Firmware Flash Memory
W25Q32FVSSIQ
Firmware Flash Memory
DDR4
RAM Type
WGI219LM
LAN Controller
RTS5242
Card Reader IC
NPCT650JB2YX
TPM / Security IC
PS8713B
USB Controller
TPS65982
USB Controller
PS8331
Signal Conditioning IC
PS8338
Signal Conditioning IC
PS8468
Signal Conditioning IC
PS8558B
Signal Conditioning IC
T8034HN
TPM / Security IC
HD3SS214
Signal Conditioning IC
Attachments
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