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Technical Specifications
Technical Summary
This Compal Z3ENN motherboard, designated LA-B551P revision 1.0, is built around the Nvidia Logan processor platform. The system firmware is stored on a W25Q32DW SPI ROM. Embedded controller functions are handled by an STM32L100 microcontroller. Power management is provided by an AS3722 PMIC, while battery charging is managed by a BQ24735 charger IC. Audio processing is performed by a MAX9809X audio codec. System memory consists of DDR3L configured as 256/512Mb*16. Thermal monitoring is implemented using both TMP451 and G781 sensors. Wireless connectivity is provided by an AW-CM389NF module.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a W25Q32DW.
Q: What EC/KBC controller is used on this motherboard?
A: The embedded controller is an STM32L100.
Q: What is the charging IC on this motherboard?
A: The charging IC is a BQ24735.
Q: What is the CPU platform for this motherboard?
A: The CPU platform is Nvidia Logan.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | Compal |
| Model | Z3ENN |
| Motherboard Manufacturer | Compal Electronics, Inc. |
| Project Code | Z3ENN M/B LA-B551P |
| Board Number | LA-B551P |
| Revision | 1.0 |
| Date | 2014-05-28 |
| CPU Platform | Nvidia Logan |
| EC / KBC | STM32L100 |
| Audio Codec | MAX9809X |
| BIOS / SPI Flash | W25Q32DW |
| Charging IC | BQ24735 |
| Power IC(s) | AS3722 |
| RAM Type | DDR3L |
| RAM Architecture | 256/512Mb*16 |
| Thermal Sensor | TMP451 |
| Thermal Sensor | G781 |
| WiFi / WLAN IC | AW-CM389NF |
Technical Summary
This Compal Z3ENN motherboard, designated LA-B551P revision 1.0, is built around the Nvidia Logan processor platform. The system firmware is stored on a W25Q32DW SPI ROM. Embedded controller functions are handled by an STM32L100 microcontroller. Power management is provided by an AS3722 PMIC, while battery charging is managed by a BQ24735 charger IC. Audio processing is performed by a MAX9809X audio codec. System memory consists of DDR3L configured as 256/512Mb*16. Thermal monitoring is implemented using both TMP451 and G781 sensors. Wireless connectivity is provided by an AW-CM389NF module.
Technician FAQ
Q: What BIOS IC model is used on this motherboard?
A: The BIOS SPI ROM is a W25Q32DW.
Q: What EC/KBC controller is used on this motherboard?
A: The embedded controller is an STM32L100.
Q: What is the charging IC on this motherboard?
A: The charging IC is a BQ24735.
Q: What is the CPU platform for this motherboard?
A: The CPU platform is Nvidia Logan.
Technical data structured and organized by Dr-Bios.com, based on original schematic source analysis.
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
Indexed motherboard components
Open a component to see every indexed schematic that uses the same part.
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